SMT production line, surface mount technology (SurfaceMountTechnology for short SMT) is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. It is characterized by the use of component surface mount technology and reflow soldering technology, and has become a new generation of electronic product manufacturing. Assembly technology. The main equipment of the SMT production line includes: printing machine, placement machine (electronic components on the upper surface), reflow soldering, plug-in, wave furnace, test packaging. The wide application of SMT has promoted the miniaturization and multi-functionalization of electronic products, and has provided conditions for mass production and low defect rate production. SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology.
Production program preparation The production program needs to prepare the following types of data, and the preparation needs to be carried out in the following order.
PWB/Stencil Data →
Printer Condition Data →
Inspection Data → Cleaning Data → (Solder Paste) Supplementary Data Input
(Dispensation Data) ) The above data needs to be compiled mainly for the first item (PWB and screen data), the second item (printing condition data) and the fourth item (cleaning data).
3. Data input: Use the ALT key to activate the menu selection
2, Data Input
1, PWB/Stencil Data, and a PWB board/net board data input screen will pop up. The data that needs to be input in this screen are:
1) PWB ID----The code name of the PWB currently produced.
2) PWB size (X, Y)---the length and width dimensions of the current PWB produced.
3) Layout offset (X, Y)-the deviation of the current production PWB (generally refers to the lower right corner of the PWB).
4) Thickness(Z)-----The thickness of the PWB board currently produced.
5) Stencil ID----The code of the currently used net board.
6) Stencil size (X, Y)---the length and width dimensions of the currently used stencil.
7) Printer layout standard----Select the mode of the deviation standard of the current printing.
8) Origin offset (X, Y)-----The deviation between the PWB reference point and the screen reference point.
9) PWB type-----Select PWB type in the selection box.
10) BOC mark NO.1 (X, Y)-------The deviation of PWB and stencil corrects the coordinates of the first recognition point.
11) BOC mark NO.2 (X, Y)-------The deviation of PWB and stencil corrects the coordinates of the second recognition point.
12) The asterisk after SOC mark NO.1, SOC mark NO.2, BOC mark NO.1, BOC mark NO.2 indicates the identification information of the identification point.
Adjustment method:
1. Move the cursor to the asterisk corresponding to the identification point, and press the "Camera" button on the HOD (Handheld Operating Device).
2. First adjust the shape of the recognition point, adjust the recognition frame to be tangent to the periphery of the recognition point, press "Enter" to confirm and use the arrow keys to select the shape of the recognition point, select the corresponding shape, and then press "Enter" to confirm.
3. Use the arrow keys to adjust the sensitivity of recognition. After adjustment, press "Enter" to confirm.
4. Use the arrow keys to adjust the range of recognition, first adjust the upper left, then adjust the lower right, press "Enter" to confirm after adjustment. After compiling the above data, you can start compiling the printing condition data, you can use the ALT key to activate the menu to select 3, Change 2Printer Condition Data or directly press "F6" to switch to the printing condition data compilation screen.